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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
05-7350-10

05-7350-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

7,067 9.31
- +

RFQ

05-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7380-10

05-7380-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

8,556 9.31
- +

RFQ

05-7380-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7500-10

05-7500-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

6,580 9.31
- +

RFQ

05-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7560-10

05-7560-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

7,233 9.31
- +

RFQ

05-7560-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7650-10

05-7650-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

6,425 9.31
- +

RFQ

05-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
05-7880-10

05-7880-10

CONN SOCKET SIP 5POS TIN

Aries Electronics

5,428 9.31
- +

RFQ

05-7880-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 5 (1 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
33-0518-11H

33-0518-11H

CONN SOCKET SIP 33POS GOLD

Aries Electronics

7,864 9.31
- +

RFQ

33-0518-11H

Datasheet

Bulk 518 Active SIP 33 (1 x 33) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-151-41-013000

346-93-151-41-013000

CONN SOCKET SIP 51POS GOLD

Mill-Max Manufacturing Corp.

8,039 9.33
- +

RFQ

346-93-151-41-013000

Datasheet

Bulk 346 Active SIP 51 (1 x 51) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-151-41-013000

346-43-151-41-013000

CONN SOCKET SIP 51POS GOLD

Mill-Max Manufacturing Corp.

6,600 9.33
- +

RFQ

346-43-151-41-013000

Datasheet

Bulk 346 Active SIP 51 (1 x 51) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
14-C195-00

14-C195-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

8,885 9.33
- +

RFQ

14-C195-00

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-C280-00

14-C280-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

9,626 9.33
- +

RFQ

14-C280-00

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-820-90TWR

14-820-90TWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

6,475 9.33
- +

RFQ

14-820-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
299-43-626-10-002000

299-43-626-10-002000

CONN IC DIP SOCKET 26POS GOLD

Mill-Max Manufacturing Corp.

8,496 9.35
- +

RFQ

299-43-626-10-002000

Datasheet

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6518-10H

40-6518-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

8,058 9.36
- +

RFQ

40-6518-10H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-0518-00

38-0518-00

CONN SOCKET SIP 38POS GOLD

Aries Electronics

9,804 9.36
- +

RFQ

38-0518-00

Datasheet

Bulk 518 Active SIP 38 (1 x 38) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-1518-00

38-1518-00

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

9,843 9.36
- +

RFQ

38-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0517-90C

22-0517-90C

CONN SOCKET SIP 22POS GOLD

Aries Electronics

9,805 9.36
- +

RFQ

22-0517-90C

Datasheet

Bulk 0517 Active SIP 22 (1 x 22) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-640-T-A

APA-640-T-A

ADAPTER PLUG

Samtec Inc.

9,498 9.37
- +

RFQ

Bulk APA Active - 40 (2 x 20) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
36-0511-10

36-0511-10

CONN SOCKET SIP 36POS TIN

Aries Electronics

8,075 9.40
- +

RFQ

36-0511-10

Datasheet

Bulk 511 Active SIP 36 (1 x 36) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-9513-10H

20-9513-10H

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

6,879 9.40
- +

RFQ

20-9513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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