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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
210-99-640-41-001000

210-99-640-41-001000

CONN IC DIP SOCKET 40POS TINLEAD

Mill-Max Manufacturing Corp.

2,833 13.54
- +

RFQ

210-99-640-41-001000

Datasheet

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-44-640-41-001000

210-44-640-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,265 13.54
- +

RFQ

210-44-640-41-001000

Datasheet

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-322-41-117000

114-93-322-41-117000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

3,824 13.54
- +

RFQ

114-93-322-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-422-41-117000

114-93-422-41-117000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

1,328 13.54
- +

RFQ

114-93-422-41-117000

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-322-41-117000

114-43-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,166 13.54
- +

RFQ

114-43-322-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6820-90C

24-6820-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,849 13.58
- +

RFQ

24-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6822-90C

24-6822-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,747 13.58
- +

RFQ

24-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6823-90C

24-6823-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,188 13.58
- +

RFQ

24-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-41-316-41-105000

110-41-316-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,700 13.58
- +

RFQ

110-41-316-41-105000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-424-41-001000

110-11-424-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,938 13.61
- +

RFQ

110-11-424-41-001000

Datasheet

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-322-41-117000

114-41-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,588 13.61
- +

RFQ

114-41-322-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-422-41-117000

114-41-422-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,127 13.61
- +

RFQ

114-41-422-41-117000

Datasheet

Tube 114 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-322-41-117000

114-91-322-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,870 13.61
- +

RFQ

114-91-322-41-117000

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-314-31-007000

614-91-314-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,970 13.55
- +

RFQ

614-91-314-31-007000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
15-7350-10

15-7350-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,243 13.55
- +

RFQ

15-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7450-10

15-7450-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,303 13.55
- +

RFQ

15-7450-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7500-10

15-7500-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

1,787 13.55
- +

RFQ

15-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7540-10

15-7540-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

2,026 13.55
- +

RFQ

15-7540-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7635-10

15-7635-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,771 13.55
- +

RFQ

15-7635-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-7695-10

15-7695-10

CONN SOCKET SIP 15POS TIN

Aries Electronics

3,777 13.55
- +

RFQ

15-7695-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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