+86 14706745934 Josh@g2flyinc.com Upload BOM Welcome to G2 Electronics
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
48-6501-20

48-6501-20

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

4,691 13.67
- +

RFQ

48-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
48-6501-30

48-6501-30

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

1,709 13.67
- +

RFQ

48-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-6503-21

14-6503-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,472 13.67
- +

RFQ

14-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-6503-31

14-6503-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,233 13.67
- +

RFQ

14-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
410-91-214-10-002000

410-91-214-10-002000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,748 13.67
- +

RFQ

410-91-214-10-002000

Datasheet

Tube 410 Active Zig-Zag, Right Stackable 14 (2 x 7) 0.100 (2.54mm) - - Beryllium Copper Through Hole - Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-93-114-41-005000

317-93-114-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

3,044 13.67
- +

RFQ

317-93-114-41-005000

Datasheet

Bulk 317 Active SIP 14 (1 x 14) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-248-31-018000

714-43-248-31-018000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3,976 13.67
- +

RFQ

714-43-248-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-320-41-012000

146-93-320-41-012000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

1,746 13.67
- +

RFQ

146-93-320-41-012000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-320-41-012000

146-43-320-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

3,806 13.67
- +

RFQ

146-43-320-41-012000

Datasheet

Tube 146 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-9503-20

20-9503-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,791 13.84
- +

RFQ

20-9503-20

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-9503-30

20-9503-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,538 13.84
- +

RFQ

20-9503-30

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
25-0503-20

25-0503-20

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2,315 13.84
- +

RFQ

25-0503-20

Datasheet

Bulk 0503 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
50-9518-10H

50-9518-10H

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3,964 13.84
- +

RFQ

50-9518-10H

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
115-41-640-41-001000

115-41-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,875 13.86
- +

RFQ

115-41-640-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-91-640-41-001000

115-91-640-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

2,482 13.86
- +

RFQ

115-91-640-41-001000

Datasheet

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-71000-10

16-71000-10

CONN SOCKET SIP 16POS TIN

Aries Electronics

3,785 13.87
- +

RFQ

16-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 16 (1 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-7415-10

16-7415-10

CONN SOCKET SIP 16POS TIN

Aries Electronics

2,481 13.87
- +

RFQ

16-7415-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 16 (1 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-100-15-001101

550-10-100-15-001101

PGA SOLDER TAIL

Preci-Dip

4,050 13.32
- +

RFQ

550-10-100-15-001101

Datasheet

Bulk 550 Active PGA 100 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-41-316-31-018000

614-41-316-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,808 13.97
- +

RFQ

614-41-316-31-018000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-316-31-018000

614-91-316-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,890 13.97
- +

RFQ

614-91-316-31-018000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 43982 Records«Prev1... 359360361362363364365366...2200Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER