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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-8323-310C

20-8323-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,231 15.00
- +

RFQ

20-8323-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8325-310C

20-8325-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,081 15.00
- +

RFQ

20-8325-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8330-310C

20-8330-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,713 15.00
- +

RFQ

20-8330-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8350-310C

20-8350-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,320 15.00
- +

RFQ

20-8350-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8370-310C

20-8370-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,465 15.00
- +

RFQ

20-8370-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8375-310C

20-8375-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,365 15.00
- +

RFQ

20-8375-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8385-310C

20-8385-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,430 15.00
- +

RFQ

20-8385-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8400-310C

20-8400-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,057 15.00
- +

RFQ

20-8400-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8461-310C

20-8461-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,996 15.00
- +

RFQ

20-8461-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8500-310C

20-8500-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,807 15.00
- +

RFQ

20-8500-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8620-310C

20-8620-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,048 15.00
- +

RFQ

20-8620-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8640-310C

20-8640-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,818 15.00
- +

RFQ

20-8640-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8650-310C

20-8650-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,947 15.00
- +

RFQ

20-8650-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8685-310C

20-8685-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,284 15.00
- +

RFQ

20-8685-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8724-310C

20-8724-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,577 15.00
- +

RFQ

20-8724-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8730-310C

20-8730-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,033 15.00
- +

RFQ

20-8730-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8770-310C

20-8770-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,436 15.00
- +

RFQ

20-8770-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8800-310C

20-8800-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,083 15.00
- +

RFQ

20-8800-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8870-310C

20-8870-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,105 15.00
- +

RFQ

20-8870-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8940-310C

20-8940-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,278 15.00
- +

RFQ

20-8940-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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