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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
30-823-90C

30-823-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

4,314 15.31
- +

RFQ

30-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
114-41-950-41-117000

114-41-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,278 15.31
- +

RFQ

114-41-950-41-117000

Datasheet

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-950-41-117000

114-91-950-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,450 15.31
- +

RFQ

114-91-950-41-117000

Datasheet

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-068-11-061001

510-91-068-11-061001

SOCKET SOLDERTAIL 68-PGA

Mill-Max Manufacturing Corp.

1,415 15.31
- +

RFQ

Tube 510 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-13-318-41-001000

123-13-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2,728 15.31
- +

RFQ

123-13-318-41-001000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-068-10-041001

510-91-068-10-041001

SOCKET SOLDERTAIL 68-PGA

Mill-Max Manufacturing Corp.

4,393 15.31
- +

RFQ

510-91-068-10-041001

Datasheet

Tube 510 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
410-93-264-41-001000

410-93-264-41-001000

SOCKET DUAL IN-LINE SLDRTL 64POS

Mill-Max Manufacturing Corp.

4,784 15.32
- +

RFQ

410-93-264-41-001000

Datasheet

Tube 410 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-314-41-002000

124-93-314-41-002000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

1,740 15.32
- +

RFQ

124-93-314-41-002000

Datasheet

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-314-41-002000

124-43-314-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,350 15.32
- +

RFQ

124-43-314-41-002000

Datasheet

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-47-636-41-001000

123-47-636-41-001000

STANDARD WIRE WRAP DBL SKT

Mill-Max Manufacturing Corp.

4,531 15.32
- +

RFQ

123-47-636-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-182-14-001135

546-87-182-14-001135

CONN SOCKET PGA 182POS GOLD

Preci-Dip

1,603 14.53
- +

RFQ

546-87-182-14-001135

Datasheet

Bulk 546 Active PGA 182 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-182-14-001136

546-87-182-14-001136

CONN SOCKET PGA 182POS GOLD

Preci-Dip

1,424 14.53
- +

RFQ

546-87-182-14-001136

Datasheet

Bulk 546 Active PGA 182 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
111-41-650-41-001000

111-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,311 15.32
- +

RFQ

111-41-650-41-001000

Datasheet

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-650-41-001000

111-91-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,285 15.32
- +

RFQ

111-91-650-41-001000

Datasheet

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-316-41-001000

122-11-316-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,493 15.33
- +

RFQ

122-11-316-41-001000

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-81000-610C

20-81000-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,611 15.33
- +

RFQ

20-81000-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81250-610C

20-81250-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,575 15.33
- +

RFQ

20-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8400-610C

20-8400-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,042 15.33
- +

RFQ

20-8400-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8500-610C

20-8500-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,487 15.33
- +

RFQ

20-8500-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8675-610C

20-8675-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,309 15.33
- +

RFQ

20-8675-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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    Quality premium after-sale service.
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