+86 14706745934 Josh@g2flyinc.com Upload BOM Welcome to G2 Electronics
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
126-43-328-41-002000

126-43-328-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,019 16.54
- +

RFQ

126-43-328-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-428-41-002000

126-43-428-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,089 16.54
- +

RFQ

126-43-428-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-628-41-002000

126-43-628-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,389 16.54
- +

RFQ

126-43-628-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-328-41-001000

116-47-328-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,679 16.54
- +

RFQ

116-47-328-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-428-41-001000

116-47-428-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,228 16.54
- +

RFQ

116-47-428-41-001000

Datasheet

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-628-41-001000

116-47-628-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,102 16.54
- +

RFQ

116-47-628-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-83-132-13-041112

614-83-132-13-041112

CONN SOCKET PGA 132POS GOLD

Preci-Dip

2,826 15.70
- +

RFQ

614-83-132-13-041112

Datasheet

Bulk 614 Active PGA 132 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
27-0501-20

27-0501-20

CONN SOCKET SIP 27POS TIN

Aries Electronics

3,826 16.54
- +

RFQ

27-0501-20

Datasheet

Bulk 501 Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-0501-30

27-0501-30

CONN SOCKET SIP 27POS TIN

Aries Electronics

1,653 16.54
- +

RFQ

27-0501-30

Datasheet

Bulk 501 Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6503-21

18-6503-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,787 16.54
- +

RFQ

18-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-201

32-6508-201

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,974 16.54
- +

RFQ

32-6508-201

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-301

32-6508-301

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,512 16.54
- +

RFQ

32-6508-301

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-93-950-41-001000

110-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,639 16.55
- +

RFQ

110-93-950-41-001000

Datasheet

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-280-18-101111

517-83-280-18-101111

CONN SOCKET PGA 280POS GOLD

Preci-Dip

2,660 15.74
- +

RFQ

517-83-280-18-101111

Datasheet

Bulk 517 Active PGA 280 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-43-640-31-002000

614-43-640-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,384 16.55
- +

RFQ

614-43-640-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-640-31-002000

614-93-640-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,938 16.55
- +

RFQ

614-93-640-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-636-41-007000

116-47-636-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,538 16.55
- +

RFQ

116-47-636-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-7445-10

24-7445-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

4,877 16.55
- +

RFQ

24-7445-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-7500-10

24-7500-10

CONN SOCKET SIP 24POS TIN

Aries Electronics

3,771 16.55
- +

RFQ

24-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-01

32-6518-01

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,224 16.55
- +

RFQ

32-6518-01

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 43982 Records«Prev1... 474475476477478479480481...2200Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER