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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-91-952-31-002000

614-91-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,018 18.24
- +

RFQ

614-91-952-31-002000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-642-41-002000

126-41-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,916 18.24
- +

RFQ

126-41-642-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-642-41-002000

126-91-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,525 18.24
- +

RFQ

126-91-642-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
36-3551-10

36-3551-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,877 18.24
- +

RFQ

36-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3553-10

36-3553-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,811 18.24
- +

RFQ

36-3553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6551-10

36-6551-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,425 18.24
- +

RFQ

36-6551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6552-10

36-6552-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,694 18.24
- +

RFQ

36-6552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6553-10

36-6553-10

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,193 18.24
- +

RFQ

36-6553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3552-10

36-3552-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,885 18.24
- +

RFQ

36-3552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3554-10

36-3554-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,845 18.24
- +

RFQ

36-3554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6554-10

36-6554-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,573 18.24
- +

RFQ

36-6554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-1508-20

42-1508-20

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

1,327 18.24
- +

RFQ

42-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
612-11-636-41-001000

612-11-636-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,920 18.25
- +

RFQ

612-11-636-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-652-31-018000

614-93-652-31-018000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

2,618 18.26
- +

RFQ

614-93-652-31-018000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-652-31-018000

614-43-652-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,330 18.26
- +

RFQ

614-43-652-31-018000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-310-61-001000

110-44-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,796 18.27
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-310-61-001000

110-99-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,992 18.27
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
614-93-952-31-012000

614-93-952-31-012000

SOCKET CARRIER LOWPRO .900 52POS

Mill-Max Manufacturing Corp.

2,571 18.30
- +

RFQ

614-93-952-31-012000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-952-31-012000

614-43-952-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,879 18.30
- +

RFQ

614-43-952-31-012000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-6503-21

20-6503-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,681 18.31
- +

RFQ

20-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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