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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-93-306-61-605000

110-93-306-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,267 19.43
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-44-420-61-001000

110-44-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,559 19.43
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-420-61-001000

110-99-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,995 19.43
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
612-43-648-41-003000

612-43-648-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,297 19.44
- +

RFQ

612-43-648-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-648-41-003000

612-93-648-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,502 19.44
- +

RFQ

612-93-648-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-328-41-801000

122-13-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,621 19.44
- +

RFQ

122-13-328-41-801000

Datasheet

Tube 122 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6553-11

32-6553-11

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

2,597 19.45
- +

RFQ

32-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3503-21

24-3503-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,122 19.45
- +

RFQ

24-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-3503-31

24-3503-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,820 19.45
- +

RFQ

24-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
127-41-652-41-003000

127-41-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,735 19.45
- +

RFQ

127-41-652-41-003000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-652-41-003000

127-91-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,214 19.45
- +

RFQ

127-91-652-41-003000

Datasheet

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-310-61-006000

116-43-310-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,865 19.46
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-310-61-006000

116-93-310-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,683 19.46
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
36-6556-30

36-6556-30

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,820 19.47
- +

RFQ

36-6556-30

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
36-6556-20

36-6556-20

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,051 19.47
- +

RFQ

36-6556-20

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
64-9513-10H

64-9513-10H

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

1,798 19.47
- +

RFQ

64-9513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
122-13-642-41-001000

122-13-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

2,838 19.47
- +

RFQ

122-13-642-41-001000

Datasheet

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6501-31

40-6501-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,797 19.49
- +

RFQ

40-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-81000-310C

32-81000-310C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,470 19.49
- +

RFQ

32-81000-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-81000-610C

32-81000-610C

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

2,962 19.49
- +

RFQ

32-81000-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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