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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
517-87-463-19-101111

517-87-463-19-101111

CONN SOCKET PGA 463POS GOLD

Preci-Dip

3,058 18.94
- +

RFQ

517-87-463-19-101111

Datasheet

Bulk 517 Active PGA 463 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-43-950-41-003000

612-43-950-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,603 20.05
- +

RFQ

612-43-950-41-003000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-950-41-003000

612-93-950-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,841 20.05
- +

RFQ

612-93-950-41-003000

Datasheet

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-652-41-001000

612-93-652-41-001000

SOCKET CARRIER SLDRTL .600 52POS

Mill-Max Manufacturing Corp.

1,396 20.06
- +

RFQ

612-93-652-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-652-41-001000

612-43-652-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,458 20.06
- +

RFQ

612-43-652-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
22-4503-21

22-4503-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,104 20.07
- +

RFQ

22-4503-21

Datasheet

Bulk 503 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-4503-31

22-4503-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,147 20.07
- +

RFQ

22-4503-31

Datasheet

Bulk 503 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0508-21

24-0508-21

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,424 20.07
- +

RFQ

24-0508-21

Datasheet

Bulk 508 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
24-0508-31

24-0508-31

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,680 20.07
- +

RFQ

24-0508-31

Datasheet

Bulk 508 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
24-1508-21

24-1508-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,128 20.07
- +

RFQ

24-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
24-1508-31

24-1508-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,602 20.07
- +

RFQ

24-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
116-43-306-61-001000

116-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,625 20.07
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-306-61-001000

116-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,319 20.07
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
126-93-652-41-001000

126-93-652-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

2,719 20.07
- +

RFQ

126-93-652-41-001000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-652-41-001000

126-43-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,641 20.07
- +

RFQ

126-43-652-41-001000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-314-61-001000

115-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,046 20.09
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
121-13-650-41-001000

121-13-650-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3,308 20.10
- +

RFQ

121-13-650-41-001000

Datasheet

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-6820-90C

38-6820-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,402 20.11
- +

RFQ

38-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-6822-90C

38-6822-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,086 20.11
- +

RFQ

38-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-6823-90C

38-6823-90C

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,225 20.11
- +

RFQ

38-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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