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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-10-072-11-061101

550-10-072-11-061101

PGA SOLDER TAIL

Preci-Dip

7,101 9.94
- +

RFQ

550-10-072-11-061101

Datasheet

Bulk 550 Active PGA 72 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-3513-10H

32-3513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,240 10.50
- +

RFQ

32-3513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-87-648-41-013101

116-87-648-41-013101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

8,999 9.95
- +

RFQ

116-87-648-41-013101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
8080-1G45

8080-1G45

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

3,120 10.52
- +

RFQ

Bulk 8060 Active Transistor, TO-3 3 (Oval) - Tin - Beryllium Copper Chassis Mount Closed Frame Solder - Tin - Beryllium Copper Polytetrafluoroethylene (PTFE)
14-3508-202

14-3508-202

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,879 10.53
- +

RFQ

14-3508-202

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3508-302

14-3508-302

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

4,037 10.53
- +

RFQ

14-3508-302

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-139-31-018000

714-43-139-31-018000

CONN SOCKET SIP 39POS GOLD

Mill-Max Manufacturing Corp.

2,550 10.54
- +

RFQ

714-43-139-31-018000

Datasheet

Bulk 714 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-100-10-000112

614-87-100-10-000112

CONN SOCKET PGA 100POS GOLD

Preci-Dip

8,693 10.00
- +

RFQ

614-87-100-10-000112

Datasheet

Bulk 614 Active PGA 100 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
32-6501-20

32-6501-20

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

3,638 10.55
- +

RFQ

32-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6501-30

32-6501-30

CONN IC DIP SOCKET 32POS TIN

Aries Electronics

1,539 10.55
- +

RFQ

32-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3501-21

18-3501-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,781 10.55
- +

RFQ

18-3501-21

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3501-31

18-3501-31

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

1,290 10.55
- +

RFQ

18-3501-31

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-T-P

APA-628-T-P

ADAPTER PLUG

Samtec Inc.

2,108 10.56
- +

RFQ

Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
38-6501-20

38-6501-20

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

1,671 10.57
- +

RFQ

38-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-6501-30

38-6501-30

CONN IC DIP SOCKET 38POS TIN

Aries Electronics

1,031 10.57
- +

RFQ

38-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-6503-20

20-6503-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,144 10.58
- +

RFQ

20-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-6503-30

20-6503-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,628 10.58
- +

RFQ

20-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
23-0508-20

23-0508-20

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,706 10.58
- +

RFQ

23-0508-20

Datasheet

Bulk 508 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
23-0508-30

23-0508-30

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,648 10.58
- +

RFQ

23-0508-30

Datasheet

Bulk 508 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
28-6518-11H

28-6518-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,124 10.58
- +

RFQ

28-6518-11H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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