+86 14706745934 Josh@g2flyinc.com Upload BOM Welcome to G2 Electronics
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-6823-90T

18-6823-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

1,462 10.69
- +

RFQ

18-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-820-90C

18-820-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,712 10.69
- +

RFQ

18-820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-822-90C

18-822-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,174 10.69
- +

RFQ

18-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-823-90C

18-823-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,736 10.69
- +

RFQ

18-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-6513-10H

30-6513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,157 10.69
- +

RFQ

30-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6503-21

12-6503-21

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,578 10.71
- +

RFQ

12-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-6503-31

12-6503-31

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,420 10.71
- +

RFQ

12-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
714-43-236-31-018000

714-43-236-31-018000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

1,365 10.72
- +

RFQ

714-43-236-31-018000

Datasheet

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
60-9513-10

60-9513-10

CONN IC DIP SOCKET 60POS GOLD

Aries Electronics

3,568 10.73
- +

RFQ

60-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 60 (2 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
19-0503-20

19-0503-20

CONN SOCKET SIP 19POS GOLD

Aries Electronics

4,742 10.73
- +

RFQ

19-0503-20

Datasheet

Bulk 0503 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
19-0503-30

19-0503-30

CONN SOCKET SIP 19POS GOLD

Aries Electronics

4,010 10.73
- +

RFQ

19-0503-30

Datasheet

Bulk 0503 Active SIP 19 (1 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled
12-6810-90T

12-6810-90T

CONN IC DIP SOCKET 12POS TIN

Aries Electronics

4,823 10.73
- +

RFQ

12-6810-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
ICO-632-NGT

ICO-632-NGT

CONN IC DIP SOCKET 32POS GOLD

Samtec Inc.

3,085 10.73
- +

RFQ

ICO-632-NGT

Datasheet

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
510-83-221-18-091101

510-83-221-18-091101

CONN SOCKET PGA 221POS GOLD

Preci-Dip

3,955 10.20
- +

RFQ

510-83-221-18-091101

Datasheet

Bulk 510 Active PGA 221 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-6518-10E

28-6518-10E

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,524 10.77
- +

RFQ

28-6518-10E

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
15-0501-20

15-0501-20

CONN SOCKET SIP 15POS TIN

Aries Electronics

2,753 10.77
- +

RFQ

15-0501-20

Datasheet

Bulk 501 Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
15-0501-30

15-0501-30

CONN SOCKET SIP 15POS TIN

Aries Electronics

4,194 10.77
- +

RFQ

15-0501-30

Datasheet

Bulk 501 Active SIP 15 (1 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6503-20

22-6503-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,711 10.77
- +

RFQ

22-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-6503-30

22-6503-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,974 10.77
- +

RFQ

22-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-6503-20

24-6503-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,739 10.77
- +

RFQ

24-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 43982 Records«Prev1... 280281282283284285286287...2200Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER