+86 14706745934 Josh@g2flyinc.com Upload BOM Welcome to G2 Electronics
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
09-7350-10

09-7350-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

2,963 10.80
- +

RFQ

09-7350-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7375-10

09-7375-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

3,164 10.80
- +

RFQ

09-7375-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7380-10

09-7380-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

1,928 10.80
- +

RFQ

09-7380-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7420-10

09-7420-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

3,152 10.80
- +

RFQ

09-7420-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7450-10

09-7450-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

4,975 10.80
- +

RFQ

09-7450-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7500-10

09-7500-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

2,420 10.80
- +

RFQ

09-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7510-10

09-7510-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

4,177 10.80
- +

RFQ

09-7510-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7870-10

09-7870-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

4,625 10.80
- +

RFQ

09-7870-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
09-7970-10

09-7970-10

CONN SOCKET SIP 9POS TIN

Aries Electronics

1,594 10.80
- +

RFQ

09-7970-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
64-9513-10

64-9513-10

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

1,097 10.80
- +

RFQ

64-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-159-41-013000

346-93-159-41-013000

CONN SOCKET SIP 59POS GOLD

Mill-Max Manufacturing Corp.

3,701 10.80
- +

RFQ

346-93-159-41-013000

Datasheet

Bulk 346 Active SIP 59 (1 x 59) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-159-41-013000

346-43-159-41-013000

CONN SOCKET SIP 59POS GOLD

Mill-Max Manufacturing Corp.

2,214 10.80
- +

RFQ

346-43-159-41-013000

Datasheet

Bulk 346 Active SIP 59 (1 x 59) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-87-650-41-013101

116-87-650-41-013101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

2,970 10.37
- +

RFQ

116-87-650-41-013101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-140-31-018000

714-43-140-31-018000

CONN SOCKET SIP 40POS GOLD

Mill-Max Manufacturing Corp.

3,209 10.81
- +

RFQ

714-43-140-31-018000

Datasheet

Bulk 714 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
10-9503-21

10-9503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

2,134 10.83
- +

RFQ

10-9503-21

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-9503-31

10-9503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

4,045 10.83
- +

RFQ

10-9503-31

Datasheet

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-0508-20

26-0508-20

CONN SOCKET SIP 26POS GOLD

Aries Electronics

4,824 10.83
- +

RFQ

26-0508-20

Datasheet

Bulk 508 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
26-0508-30

26-0508-30

CONN SOCKET SIP 26POS GOLD

Aries Electronics

2,986 10.83
- +

RFQ

26-0508-30

Datasheet

Bulk 508 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
26-1508-20

26-1508-20

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,459 10.83
- +

RFQ

26-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
26-1508-30

26-1508-30

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,338 10.83
- +

RFQ

26-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 26 (2 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
Total 43982 Records«Prev1... 282283284285286287288289...2200Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER