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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
30-3513-11H

30-3513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

1,741 16.07
- +

RFQ

30-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-11-320-41-001000

612-11-320-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,762 16.07
- +

RFQ

612-11-320-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
315-99-164-41-003000

315-99-164-41-003000

SOCKET LOW PROFILE SIP 64POS

Mill-Max Manufacturing Corp.

4,589 16.07
- +

RFQ

Tube 315 Active SIP 64 (1 x 64) 0.100 (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
37-0508-20

37-0508-20

CONN SOCKET SIP 37POS GOLD

Aries Electronics

2,659 16.08
- +

RFQ

37-0508-20

Datasheet

Bulk 508 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
37-0508-30

37-0508-30

CONN SOCKET SIP 37POS GOLD

Aries Electronics

2,528 16.08
- +

RFQ

37-0508-30

Datasheet

Bulk 508 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
18-6621-30

18-6621-30

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

3,663 16.08
- +

RFQ

18-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-640-41-007000

116-93-640-41-007000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,732 16.08
- +

RFQ

116-93-640-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-640-41-007000

116-43-640-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,671 16.08
- +

RFQ

116-43-640-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-99-164-41-013000

346-99-164-41-013000

CONN SOCKET SIP 64POS TIN-LEAD

Mill-Max Manufacturing Corp.

1,158 16.08
- +

RFQ

346-99-164-41-013000

Datasheet

Tube 346 Active SIP 64 (1 x 64) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-950-41-001000

115-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,780 16.09
- +

RFQ

115-93-950-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-950-41-001000

115-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,426 16.09
- +

RFQ

115-43-950-41-001000

Datasheet

Tube 115 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-650-41-007000

116-47-650-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

1,790 16.09
- +

RFQ

116-47-650-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
26-0501-20

26-0501-20

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,671 16.10
- +

RFQ

26-0501-20

Datasheet

Bulk 501 Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-0501-30

26-0501-30

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,986 16.10
- +

RFQ

26-0501-30

Datasheet

Bulk 501 Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
605-41-328-11-480000

605-41-328-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,917 16.10
- +

RFQ

605-41-328-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-428-11-480000

605-41-428-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

2,628 16.10
- +

RFQ

605-41-428-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-628-11-480000

605-41-628-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

4,389 16.10
- +

RFQ

605-41-628-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-328-11-480000

605-91-328-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

1,064 16.10
- +

RFQ

605-91-328-11-480000

Datasheet

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-428-11-480000

605-91-428-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,150 16.10
- +

RFQ

605-91-428-11-480000

Datasheet

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-628-11-480000

605-91-628-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

3,561 16.10
- +

RFQ

605-91-628-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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    Quality premium after-sale service.
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