+86 14706745934 Josh@g2flyinc.com Upload BOM Welcome to G2 Electronics
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
123-41-428-41-001000

123-41-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,149 16.11
- +

RFQ

123-41-428-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-628-41-001000

123-41-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,432 16.11
- +

RFQ

123-41-628-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-636-31-007000

614-93-636-31-007000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

2,714 16.12
- +

RFQ

614-93-636-31-007000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-636-31-007000

614-43-636-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,276 16.12
- +

RFQ

614-43-636-31-007000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
3883-312-10-32

3883-312-10-32

SER 6556 UNIV TEST SCKT RECEP

Aries Electronics

1,236 16.12
- +

RFQ

3883-312-10-32

Datasheet

- - Active - - - - - - - - - - - - - -
APA-422-G-M

APA-422-G-M

ADAPTER PLUG

Samtec Inc.

1,353 16.12
- +

RFQ

Bulk APA Active - 22 (2 x 11) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
210-41-964-41-001000

210-41-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,059 16.12
- +

RFQ

210-41-964-41-001000

Datasheet

Tube 210 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-964-41-001000

210-91-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,234 16.12
- +

RFQ

210-91-964-41-001000

Datasheet

Tube 210 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-642-41-001000

123-91-642-41-001000

SOCKET IC OPEN 3 LVL .600 42POS

Mill-Max Manufacturing Corp.

2,996 16.12
- +

RFQ

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-642-41-001000

123-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,278 16.12
- +

RFQ

123-41-642-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-87-192-14-001135

546-87-192-14-001135

CONN SOCKET PGA 192POS GOLD

Preci-Dip

1,403 15.33
- +

RFQ

546-87-192-14-001135

Datasheet

Bulk 546 Active PGA 192 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-192-14-001136

546-87-192-14-001136

CONN SOCKET PGA 192POS GOLD

Preci-Dip

3,181 15.33
- +

RFQ

546-87-192-14-001136

Datasheet

Bulk 546 Active PGA 192 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
28-3571-10

28-3571-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2,696 16.13
- +

RFQ

28-3571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3572-10

28-3572-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2,939 16.13
- +

RFQ

28-3572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3573-10

28-3573-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

1,607 16.13
- +

RFQ

28-3573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3574-10

28-3574-10

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

2,220 16.13
- +

RFQ

28-3574-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6571-10

28-6571-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

1,279 16.13
- +

RFQ

28-6571-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6572-10

28-6572-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

2,737 16.13
- +

RFQ

28-6572-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-6573-10

28-6573-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

4,846 16.13
- +

RFQ

28-6573-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3570-10

28-3570-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

3,022 16.13
- +

RFQ

28-3570-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 43982 Records«Prev1... 457458459460461462463464...2200Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER