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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
612-91-640-41-004000

612-91-640-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,021 17.51
- +

RFQ

612-91-640-41-004000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
26-71250-10

26-71250-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

4,376 17.52
- +

RFQ

26-71250-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-7500-10

26-7500-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

3,816 17.52
- +

RFQ

26-7500-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-7590-10

26-7590-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

4,954 17.52
- +

RFQ

26-7590-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-7650-10

26-7650-10

CONN SOCKET SIP 26POS TIN

Aries Electronics

4,321 17.52
- +

RFQ

26-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 26 (1 x 26) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
316-93-132-41-001000

316-93-132-41-001000

SOCKET ELEVATED SIP 32POS

Mill-Max Manufacturing Corp.

1,746 17.52
- +

RFQ

316-93-132-41-001000

Datasheet

Tube 316 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-950-41-001000

614-41-950-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,765 17.53
- +

RFQ

614-41-950-41-001000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-950-41-001000

614-91-950-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,586 17.53
- +

RFQ

614-91-950-41-001000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-640-41-001000

612-93-640-41-001000

SOCKET CARRIER SLDRTL .600 40POS

Mill-Max Manufacturing Corp.

4,639 17.53
- +

RFQ

612-93-640-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-640-41-001000

612-43-640-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,436 17.53
- +

RFQ

612-43-640-41-001000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-87-192M16-001148

514-87-192M16-001148

CONN SOCKET BGA 192POS GOLD

Preci-Dip

2,264 16.44
- +

RFQ

514-87-192M16-001148

Datasheet

Bulk 514 Active BGA 192 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-93-636-41-001000

116-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

4,014 17.54
- +

RFQ

116-93-636-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-636-41-001000

116-43-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,278 17.54
- +

RFQ

116-43-636-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-640-41-001000

126-93-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

4,346 17.54
- +

RFQ

126-93-640-41-001000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-640-41-001000

126-43-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,899 17.54
- +

RFQ

126-43-640-41-001000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-6553-11

24-6553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

1,457 17.54
- +

RFQ

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3551-11

24-3551-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,588 17.54
- +

RFQ

24-3551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3552-11

24-3552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

3,570 17.54
- +

RFQ

24-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3553-11

24-3553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

1,084 17.54
- +

RFQ

24-3553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6552-11

24-6552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

1,713 17.54
- +

RFQ

24-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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