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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-41-952-31-012000

614-41-952-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,314 17.54
- +

RFQ

614-41-952-31-012000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-952-31-012000

614-91-952-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,429 17.54
- +

RFQ

614-91-952-31-012000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-652-41-003000

116-93-652-41-003000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

3,204 17.55
- +

RFQ

116-93-652-41-003000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-648-31-018000

614-43-648-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,733 17.55
- +

RFQ

614-43-648-31-018000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-952-41-006000

116-93-952-41-006000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

1,055 17.55
- +

RFQ

116-93-952-41-006000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-952-41-006000

116-43-952-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,074 17.55
- +

RFQ

116-43-952-41-006000

Datasheet

Tube 116 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
712-13-132-41-001000

712-13-132-41-001000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.

2,209 17.56
- +

RFQ

712-13-132-41-001000

Datasheet

Tube 712 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-636-41-003000

612-43-636-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,821 17.58
- +

RFQ

612-43-636-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-636-41-003000

612-93-636-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,478 17.58
- +

RFQ

612-93-636-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
21-0508-21

21-0508-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics

4,930 17.58
- +

RFQ

21-0508-21

Datasheet

Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
21-0508-31

21-0508-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics

1,216 17.58
- +

RFQ

21-0508-31

Datasheet

Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
16-C195-21

16-C195-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,292 17.58
- +

RFQ

16-C195-21

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-31

16-C195-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,810 17.58
- +

RFQ

16-C195-31

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-21

16-C280-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,174 17.58
- +

RFQ

16-C280-21

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-31

16-C280-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,440 17.58
- +

RFQ

16-C280-31

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
514-87-321-19-121154

514-87-321-19-121154

CONN SOCKET PGA 321POS GOLD

Preci-Dip

3,679 16.72
- +

RFQ

514-87-321-19-121154

Datasheet

Bulk 514 Active PGA 321 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
321-13-132-41-001000

321-13-132-41-001000

SOCKET 1 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.

1,077 17.60
- +

RFQ

321-13-132-41-001000

Datasheet

Tube 321 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-108-12-051001

510-91-108-12-051001

SOCKET SOLDERTAIL 108-PGA

Mill-Max Manufacturing Corp.

1,347 17.60
- +

RFQ

Tube 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-432-41-002000

126-93-432-41-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,504 17.60
- +

RFQ

126-93-432-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-632-41-002000

126-93-632-41-002000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,482 17.60
- +

RFQ

126-93-632-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
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