+86 14706745934 Josh@g2flyinc.com Upload BOM Welcome to G2 Electronics
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
27-7650-10

27-7650-10

CONN SOCKET SIP 27POS TIN

Aries Electronics

2,339 17.80
- +

RFQ

27-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
123-91-652-41-001000

123-91-652-41-001000

SOCKET IC OPEN 3 LVL .600 52POS

Mill-Max Manufacturing Corp.

1,124 17.80
- +

RFQ

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-652-41-001000

123-41-652-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,603 17.80
- +

RFQ

123-41-652-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-299-16-091111

517-83-299-16-091111

CONN SOCKET PGA 299POS GOLD

Preci-Dip

3,643 16.90
- +

RFQ

517-83-299-16-091111

Datasheet

Bulk 517 Active PGA 299 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
126-41-640-41-002000

126-41-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,407 17.80
- +

RFQ

126-41-640-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-640-41-002000

126-91-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,105 17.80
- +

RFQ

126-91-640-41-002000

Datasheet

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-952-31-007000

614-41-952-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,307 17.82
- +

RFQ

614-41-952-31-007000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-952-31-007000

614-91-952-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,220 17.82
- +

RFQ

614-91-952-31-007000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-11-636-41-001000

122-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,177 17.82
- +

RFQ

122-11-636-41-001000

Datasheet

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-0511-11

16-0511-11

CONN SOCKET SIP 16POS GOLD

Aries Electronics

2,227 17.82
- +

RFQ

16-0511-11

Datasheet

Bulk 511 Active SIP 16 (1 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-93-650-41-007000

116-93-650-41-007000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,605 17.83
- +

RFQ

116-93-650-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-650-41-007000

116-43-650-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,344 17.83
- +

RFQ

116-43-650-41-007000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-648-41-770000

104-13-648-41-770000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

1,904 17.83
- +

RFQ

104-13-648-41-770000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
110-93-064-01-505000

110-93-064-01-505000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,488 17.84
- +

RFQ

110-93-064-01-505000

Datasheet

Tube 110 Active - 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - - - - 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) - -
123-13-318-41-801000

123-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

3,729 17.84
- +

RFQ

123-13-318-41-801000

Datasheet

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
XR3G-6401

XR3G-6401

CONN IC SOCKET 64POS

Omron Electronics Inc-EMC Div

6,467 9.33
- +

RFQ

XR3G-6401

Datasheet

-,Box - Active - - - - - - - - - - - - - -
614-41-952-41-001000

614-41-952-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,182 17.86
- +

RFQ

614-41-952-41-001000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-952-41-001000

614-91-952-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,722 17.86
- +

RFQ

614-91-952-41-001000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-432-41-001000

123-11-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,066 17.87
- +

RFQ

123-11-432-41-001000

Datasheet

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-11-632-41-001000

123-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,166 17.87
- +

RFQ

123-11-632-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 43982 Records«Prev1... 516517518519520521522523...2200Next»
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • Help you to save your cost and time.
    Help you to save your cost and time.
    Reliable package for your goods.
    Reliable package for your goods.
    Fast Reliable Delivery to save time.
    Fast Reliable Delivery to save time.
    Quality premium after-sale service.
    Quality premium after-sale service.
    HOME

    HOME

    PRODUCT

    PRODUCT

    PHONE

    PHONE

    USER

    USER