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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
346-43-154-41-013000

346-43-154-41-013000

CONN SOCKET SIP 54POS GOLD

Mill-Max Manufacturing Corp.

6,513 9.88
- +

RFQ

346-43-154-41-013000

Datasheet

Bulk 346 Active SIP 54 (1 x 54) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-87-640-10-002101

299-87-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

8,512 9.36
- +

RFQ

299-87-640-10-002101

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
20-3503-20

20-3503-20

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

8,020 9.89
- +

RFQ

20-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-3503-30

20-3503-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

9,567 9.89
- +

RFQ

20-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-C300-10

40-C300-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

8,775 9.89
- +

RFQ

40-C300-10

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6823-90

10-6823-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

5,174 9.89
- +

RFQ

10-6823-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
APA-324-T-B

APA-324-T-B

ADAPTER PLUG

Samtec Inc.

9,547 9.90
- +

RFQ

Bulk APA Active - 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
550-10-068-10-061101

550-10-068-10-061101

PGA SOLDER TAIL

Preci-Dip

7,211 9.38
- +

RFQ

550-10-068-10-061101

Datasheet

Bulk 550 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-068-11-061101

550-10-068-11-061101

PGA SOLDER TAIL

Preci-Dip

7,418 9.38
- +

RFQ

550-10-068-11-061101

Datasheet

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-068-11-071101

550-10-068-11-071101

PGA SOLDER TAIL

Preci-Dip

5,454 9.38
- +

RFQ

550-10-068-11-071101

Datasheet

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
ICO-628-CGT

ICO-628-CGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

5,020 9.91
- +

RFQ

ICO-628-CGT

Datasheet

Tube ICO Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
24-6518-10E

24-6518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

8,736 9.91
- +

RFQ

24-6518-10E

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-00

16-C195-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,680 10.11
- +

RFQ

16-C195-00

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-00

16-C280-00

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,136 10.11
- +

RFQ

16-C280-00

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-207-17-081101

510-83-207-17-081101

CONN SOCKET PGA 207POS GOLD

Preci-Dip

8,621 9.60
- +

RFQ

510-83-207-17-081101

Datasheet

Bulk 510 Active PGA 207 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
22-4503-20

22-4503-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,642 10.12
- +

RFQ

22-4503-20

Datasheet

Bulk 503 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-83-650-41-004101

116-83-650-41-004101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

6,896 9.46
- +

RFQ

116-83-650-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
10-4810-90C

10-4810-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

8,621 9.93
- +

RFQ

10-4810-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.4 (10.16mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6503-21

10-6503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

7,415 9.93
- +

RFQ

10-6503-21

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6503-31

10-6503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

6,212 9.93
- +

RFQ

10-6503-31

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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