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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
APA-632-T-C

APA-632-T-C

ADAPTER PLUG

Samtec Inc.

8,816 9.95
- +

RFQ

Bulk APA Active - 32 (2 x 16) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
32-6518-112

32-6518-112

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

5,443 9.95
- +

RFQ

32-6518-112

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3511-11

20-3511-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

5,769 9.95
- +

RFQ

20-3511-11

Datasheet

Bulk 511 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
12-81250-610C

12-81250-610C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

7,515 9.98
- +

RFQ

12-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8260-610C

12-8260-610C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

5,267 9.98
- +

RFQ

12-8260-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8300-610C

12-8300-610C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

8,794 9.98
- +

RFQ

12-8300-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-069-11-001101

550-10-069-11-001101

PGA SOLDER TAIL

Preci-Dip

8,168 9.52
- +

RFQ

550-10-069-11-001101

Datasheet

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-069-11-061101

550-10-069-11-061101

PGA SOLDER TAIL

Preci-Dip

9,457 9.52
- +

RFQ

550-10-069-11-061101

Datasheet

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
40-6518-10M

40-6518-10M

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

7,782 10.00
- +

RFQ

40-6518-10M

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-823-90TWR

14-823-90TWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

5,538 10.00
- +

RFQ

14-823-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-137-31-018000

714-43-137-31-018000

CONN SOCKET SIP 37POS GOLD

Mill-Max Manufacturing Corp.

9,345 10.00
- +

RFQ

714-43-137-31-018000

Datasheet

Bulk 714 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-318-G-A1

APA-318-G-A1

ADAPTER PLUG

Samtec Inc.

5,114 10.00
- +

RFQ

Bulk APA Active - 18 (2 x 9) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-316-G-M

APA-316-G-M

ADAPTER PLUG

Samtec Inc.

7,533 10.00
- +

RFQ

Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
346-93-155-41-013000

346-93-155-41-013000

CONN SOCKET SIP 55POS GOLD

Mill-Max Manufacturing Corp.

2,804 10.06
- +

RFQ

346-93-155-41-013000

Datasheet

Bulk 346 Active SIP 55 (1 x 55) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-155-41-013000

346-43-155-41-013000

CONN SOCKET SIP 55POS GOLD

Mill-Max Manufacturing Corp.

4,093 10.06
- +

RFQ

346-43-155-41-013000

Datasheet

Bulk 346 Active SIP 55 (1 x 55) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
18-6511-11

18-6511-11

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,052 10.06
- +

RFQ

18-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
50-9518-11

50-9518-11

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

1,981 10.07
- +

RFQ

50-9518-11

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-820-90

16-820-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,752 10.07
- +

RFQ

16-820-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
10-6810-90T

10-6810-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

3,817 10.07
- +

RFQ

10-6810-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
30-6501-20

30-6501-20

CONN IC DIP SOCKET 30POS TIN

Aries Electronics

2,831 10.11
- +

RFQ

30-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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