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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6501-30

28-6501-30

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

5,164 9.73
- +

RFQ

28-6501-30

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-6501-20

28-6501-20

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

8,473 9.73
- +

RFQ

28-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-71187-10

06-71187-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

6,872 9.73
- +

RFQ

06-71187-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-7360-10

06-7360-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

8,941 9.73
- +

RFQ

06-7360-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-7425-10

06-7425-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

9,092 9.73
- +

RFQ

06-7425-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
06-7755-10

06-7755-10

CONN SOCKET SIP 6POS TIN

Aries Electronics

8,637 9.73
- +

RFQ

06-7755-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 6 (1 x 6) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-11

28-3513-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

5,909 9.73
- +

RFQ

28-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9513-10T

64-9513-10T

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

8,635 9.73
- +

RFQ

64-9513-10T

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6518-11H

24-6518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

5,446 9.73
- +

RFQ

24-6518-11H

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-280-19-081101

510-87-280-19-081101

CONN SOCKET PGA 280POS GOLD

Preci-Dip

6,327 9.19
- +

RFQ

510-87-280-19-081101

Datasheet

Bulk 510 Active PGA 280 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-281-19-081101

510-87-281-19-081101

CONN SOCKET PGA 281POS GOLD

Preci-Dip

5,300 9.22
- +

RFQ

510-87-281-19-081101

Datasheet

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-13-640-41-001000

123-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

7,516 9.75
- +

RFQ

123-13-640-41-001000

Datasheet

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
10-3503-21

10-3503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

6,682 9.75
- +

RFQ

10-3503-21

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-3503-31

10-3503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

5,861 9.75
- +

RFQ

10-3503-31

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0508-21

11-0508-21

CONN SOCKET SIP 11POS GOLD

Aries Electronics

9,260 9.78
- +

RFQ

11-0508-21

Datasheet

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
11-0508-31

11-0508-31

CONN SOCKET SIP 11POS GOLD

Aries Electronics

8,716 9.78
- +

RFQ

11-0508-31

Datasheet

Bulk 508 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
12-81250-310C

12-81250-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

5,802 9.78
- +

RFQ

12-81250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8312-310C

12-8312-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

7,863 9.78
- +

RFQ

12-8312-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8355-310C

12-8355-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

6,911 9.78
- +

RFQ

12-8355-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-8358-310C

12-8358-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

5,965 9.78
- +

RFQ

12-8358-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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