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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
09-7970-11

09-7970-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

3,573 11.02
- +

RFQ

09-7970-11

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 9 (1 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0508-20

24-0508-20

CONN SOCKET SIP 24POS GOLD

Aries Electronics

4,344 11.02
- +

RFQ

24-0508-20

Datasheet

Bulk 508 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
24-0508-30

24-0508-30

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,002 11.02
- +

RFQ

24-0508-30

Datasheet

Bulk 508 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
24-1508-20

24-1508-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,980 11.02
- +

RFQ

24-1508-20

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
24-1508-30

24-1508-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,891 11.02
- +

RFQ

24-1508-30

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
40-6501-30

40-6501-30

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

3,519 11.03
- +

RFQ

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-0503-21

14-0503-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

1,922 11.03
- +

RFQ

14-0503-21

Datasheet

Bulk 0503 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
14-0503-31

14-0503-31

CONN SOCKET SIP 14POS GOLD

Aries Electronics

2,054 11.03
- +

RFQ

14-0503-31

Datasheet

Bulk 0503 Active SIP 14 (1 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
16-6501-21

16-6501-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,503 11.03
- +

RFQ

16-6501-21

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-6501-31

16-6501-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,355 11.03
- +

RFQ

16-6501-31

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6501-20

40-6501-20

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

4,267 11.03
- +

RFQ

40-6501-20

Datasheet

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-163-41-013000

346-93-163-41-013000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

1,269 11.03
- +

RFQ

346-93-163-41-013000

Datasheet

Bulk 346 Active SIP 63 (1 x 63) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-163-41-013000

346-43-163-41-013000

CONN SOCKET SIP 63POS GOLD

Mill-Max Manufacturing Corp.

4,543 11.03
- +

RFQ

346-43-163-41-013000

Datasheet

Bulk 346 Active SIP 63 (1 x 63) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-3508-21

08-3508-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,910 11.04
- +

RFQ

08-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-3508-31

08-3508-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,920 11.04
- +

RFQ

08-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-99-310-41-001000

110-99-310-41-001000

CONN IC DIP SOCKET 10POS TINLEAD

Mill-Max Manufacturing Corp.

3,870 11.04
- +

RFQ

110-99-310-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-310-41-001000

110-44-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,590 11.04
- +

RFQ

110-44-310-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-304-61-001000

110-41-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,343 11.05
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-304-61-001000

110-91-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,945 11.05
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
20-822-90TWR

20-822-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3,698 11.07
- +

RFQ

20-822-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
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