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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-8438-310C

16-8438-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,598 11.19
- +

RFQ

16-8438-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8439-310C

16-8439-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,269 11.19
- +

RFQ

16-8439-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8440-310C

16-8440-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,552 11.19
- +

RFQ

16-8440-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8450-310C

16-8450-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,955 11.19
- +

RFQ

16-8450-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8480-310C

16-8480-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,119 11.19
- +

RFQ

16-8480-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8500-310C

16-8500-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,731 11.19
- +

RFQ

16-8500-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8510-310C

16-8510-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,298 11.19
- +

RFQ

16-8510-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8530-310C

16-8530-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,296 11.19
- +

RFQ

16-8530-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8550-310C

16-8550-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,588 11.19
- +

RFQ

16-8550-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8560-310C

16-8560-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,053 11.19
- +

RFQ

16-8560-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8561-310C

16-8561-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,500 11.19
- +

RFQ

16-8561-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8590-310C

16-8590-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,342 11.19
- +

RFQ

16-8590-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8600-310C

16-8600-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,212 11.19
- +

RFQ

16-8600-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8608-310C

16-8608-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,032 11.19
- +

RFQ

16-8608-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8620-310C

16-8620-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,524 11.19
- +

RFQ

16-8620-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8625-310C

16-8625-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,526 11.19
- +

RFQ

16-8625-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8633-310C

16-8633-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,059 11.19
- +

RFQ

16-8633-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8720-310C

16-8720-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,715 11.19
- +

RFQ

16-8720-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8750-310C

16-8750-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

2,402 11.19
- +

RFQ

16-8750-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8800-310C

16-8800-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,863 11.19
- +

RFQ

16-8800-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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