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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-823-90TWR

20-823-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

4,655 11.07
- +

RFQ

20-823-90TWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
22-6823-90T

22-6823-90T

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

3,179 11.07
- +

RFQ

22-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
714-43-141-31-018000

714-43-141-31-018000

CONN SOCKET SIP 41POS GOLD

Mill-Max Manufacturing Corp.

4,934 11.08
- +

RFQ

714-43-141-31-018000

Datasheet

Bulk 714 Active SIP 41 (1 x 41) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-310-41-001000

110-47-310-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

2,130 11.10
- +

RFQ

110-47-310-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
16-0501-20

16-0501-20

CONN SOCKET SIP 16POS TIN

Aries Electronics

2,850 11.11
- +

RFQ

16-0501-20

Datasheet

Bulk 501 Active SIP 16 (1 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-0501-30

16-0501-30

CONN SOCKET SIP 16POS TIN

Aries Electronics

2,862 11.11
- +

RFQ

16-0501-30

Datasheet

Bulk 501 Active SIP 16 (1 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0501-21

11-0501-21

CONN SOCKET SIP 11POS GOLD

Aries Electronics

4,761 11.11
- +

RFQ

11-0501-21

Datasheet

Bulk 501 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0501-31

11-0501-31

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,217 11.11
- +

RFQ

11-0501-31

Datasheet

Bulk 501 Active SIP 11 (1 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
APA-320-G-A1

APA-320-G-A1

ADAPTER PLUG

Samtec Inc.

3,802 11.11
- +

RFQ

Bulk APA Active - 20 (2 x 10) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
614-87-100-13-062112

614-87-100-13-062112

CONN SOCKET PGA 100POS GOLD

Preci-Dip

3,361 10.59
- +

RFQ

614-87-100-13-062112

Datasheet

Bulk 614 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
714-43-143-31-018000

714-43-143-31-018000

CONN SOCKET SIP 43POS GOLD

Mill-Max Manufacturing Corp.

4,397 11.12
- +

RFQ

714-43-143-31-018000

Datasheet

Bulk 714 Active SIP 43 (1 x 43) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICF-632-S-O

ICF-632-S-O

CONN IC DIP SOCKET 32POS TIN

Samtec Inc.

2,906 11.13
- +

RFQ

ICF-632-S-O

Datasheet

Tube iCF Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP)
210-47-310-41-001000

210-47-310-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

4,338 11.13
- +

RFQ

210-47-310-41-001000

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-93-161-41-013000

346-93-161-41-013000

CONN SOCKET SIP 61POS GOLD

Mill-Max Manufacturing Corp.

3,972 11.16
- +

RFQ

346-93-161-41-013000

Datasheet

Bulk 346 Active SIP 61 (1 x 61) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-161-41-013000

346-43-161-41-013000

CONN SOCKET SIP 61POS GOLD

Mill-Max Manufacturing Corp.

1,848 11.16
- +

RFQ

346-43-161-41-013000

Datasheet

Bulk 346 Active SIP 61 (1 x 61) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1107659-01

1107659-01

700 ELEVATOR STRIP-LINE SOCKET

Aries Electronics

4,324 11.17
- +

RFQ

1107659-01

Datasheet

- - Active - - - - - - - - - - - - - -
32-9513-11

32-9513-11

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,077 11.17
- +

RFQ

32-9513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-3513-10H

34-3513-10H

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

1,413 11.17
- +

RFQ

34-3513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 34 (2 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-11H

24-C182-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

4,835 11.17
- +

RFQ

24-C182-11H

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-3513-11

36-3513-11

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

2,936 11.19
- +

RFQ

36-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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