Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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16-8810-310CCONN IC DIP SOCKET 16POS GOLD |
4,110 | 11.19 |
RFQ |
![]() Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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16-8850-310CCONN IC DIP SOCKET 16POS GOLD |
4,960 | 11.19 |
RFQ |
![]() Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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16-8990-310CCONN IC DIP SOCKET 16POS GOLD |
3,470 | 11.19 |
RFQ |
![]() Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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110-43-304-61-001000CONN IC SKT DBL |
1,471 | 11.19 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
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110-93-304-61-001000CONN IC SKT DBL |
3,944 | 11.19 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
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110-91-310-41-001000CONN IC DIP SOCKET 10POS GOLD |
2,309 | 11.23 |
RFQ |
![]() Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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110-41-310-41-001000CONN IC SKT DBL |
2,715 | 11.23 |
RFQ |
![]() Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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614-87-101-13-061112CONN SOCKET PGA 101POS GOLD |
1,647 | 10.69 |
RFQ |
![]() Datasheet |
Bulk | 614 | Active | PGA | 101 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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APA-648-T-AADAPTER PLUG |
3,089 | 11.23 |
RFQ |
Bulk | APA | Active | - | 48 (2 x 24) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
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APA-316-G-NADAPTER PLUG |
1,507 | 11.24 |
RFQ |
Tube | APA | Active | - | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
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510-83-256-16-000101CONN SOCKET PGA 256POS GOLD |
1,266 | 10.72 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 256 (16 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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210-41-310-41-001000CONN IC SKT DBL |
4,810 | 11.26 |
RFQ |
![]() Datasheet |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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210-91-310-41-001000CONN IC SKT DBL |
3,251 | 11.26 |
RFQ |
![]() Datasheet |
Tube | 210 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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510-83-233-18-071101CONN SOCKET PGA 233POS GOLD |
4,826 | 10.75 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 233 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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550-80-114-13-062101PGA SOLDER TAIL |
1,379 | 10.75 |
RFQ |
![]() Datasheet |
Bulk | 550 | Active | PGA | 114 (13 x 13) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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115-47-310-41-001000STANDRD SOLDRTL DBL SKT |
3,419 | 11.29 |
RFQ |
![]() Datasheet |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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510-83-232-17-061101CONN SOCKET PGA 232POS GOLD |
3,956 | 10.76 |
RFQ |
![]() Datasheet |
Bulk | 510 | Active | PGA | 232 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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614-83-088-13-062112CONN SOCKET PGA 88POS GOLD |
4,523 | 10.78 |
RFQ |
![]() Datasheet |
Bulk | 614 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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614-83-088-13-081112CONN SOCKET PGA 88POS GOLD |
1,749 | 10.78 |
RFQ |
![]() Datasheet |
Bulk | 614 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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116-87-652-41-013101CONN IC DIP SOCKET 52POS GOLD |
2,175 | 10.78 |
RFQ |
![]() Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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