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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
16-8810-310C

16-8810-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,110 11.19
- +

RFQ

16-8810-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8850-310C

16-8850-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,960 11.19
- +

RFQ

16-8850-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8990-310C

16-8990-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

3,470 11.19
- +

RFQ

16-8990-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
110-43-304-61-001000

110-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,471 11.19
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-304-61-001000

110-93-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,944 11.19
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-310-41-001000

110-91-310-41-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

2,309 11.23
- +

RFQ

110-91-310-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-310-41-001000

110-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,715 11.23
- +

RFQ

110-41-310-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-101-13-061112

614-87-101-13-061112

CONN SOCKET PGA 101POS GOLD

Preci-Dip

1,647 10.69
- +

RFQ

614-87-101-13-061112

Datasheet

Bulk 614 Active PGA 101 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-648-T-A

APA-648-T-A

ADAPTER PLUG

Samtec Inc.

3,089 11.23
- +

RFQ

Bulk APA Active - 48 (2 x 24) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
APA-316-G-N

APA-316-G-N

ADAPTER PLUG

Samtec Inc.

1,507 11.24
- +

RFQ

Tube APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-83-256-16-000101

510-83-256-16-000101

CONN SOCKET PGA 256POS GOLD

Preci-Dip

1,266 10.72
- +

RFQ

510-83-256-16-000101

Datasheet

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
210-41-310-41-001000

210-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,810 11.26
- +

RFQ

210-41-310-41-001000

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-91-310-41-001000

210-91-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,251 11.26
- +

RFQ

210-91-310-41-001000

Datasheet

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-233-18-071101

510-83-233-18-071101

CONN SOCKET PGA 233POS GOLD

Preci-Dip

4,826 10.75
- +

RFQ

510-83-233-18-071101

Datasheet

Bulk 510 Active PGA 233 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-114-13-062101

550-80-114-13-062101

PGA SOLDER TAIL

Preci-Dip

1,379 10.75
- +

RFQ

550-80-114-13-062101

Datasheet

Bulk 550 Active PGA 114 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-47-310-41-001000

115-47-310-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,419 11.29
- +

RFQ

115-47-310-41-001000

Datasheet

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-83-232-17-061101

510-83-232-17-061101

CONN SOCKET PGA 232POS GOLD

Preci-Dip

3,956 10.76
- +

RFQ

510-83-232-17-061101

Datasheet

Bulk 510 Active PGA 232 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-088-13-062112

614-83-088-13-062112

CONN SOCKET PGA 88POS GOLD

Preci-Dip

4,523 10.78
- +

RFQ

614-83-088-13-062112

Datasheet

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-088-13-081112

614-83-088-13-081112

CONN SOCKET PGA 88POS GOLD

Preci-Dip

1,749 10.78
- +

RFQ

614-83-088-13-081112

Datasheet

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-652-41-013101

116-87-652-41-013101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

2,175 10.78
- +

RFQ

116-87-652-41-013101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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